Time: 09:00 – 16:00
Venue: 3F, Sheraton Hotel Hsinchu (No. 265, Dong Sec. 1, Guangming6thRd, ZubeiCity 302, Hsinchu County)
Target Audiences:
Fabless, Packaging house, Equipment Suppliers, Materials Suppliers, Technical manager and above, Dept. Head, Sr. Technical Engineer, Procurement, Researcher, Academia, BDM, Marcom, Media
Registration Fee: NTD$ 4,500 [click to register]
No of Attendee: 150 pax
Organizer: HiConnectInternational
Co-organizer: TSIA / TSRI / TIARA
| 08:40–09:10 | Registration |
| 09:10–09:17 |
Opening Remarks Mr. Akshay Singh, VP of Advanced Packaging Technology Development, Micron |
| 09:17–09:20 |
Welcome by Moderator Mr. Albert Lan 藍章益, Senior Technical Director, AMAT |
| 09:20–10:30 |
Opening Keynote Dr. Marvin Liao 廖德堆, Vice President, Operations / Product Development / APTS, TSMC Carrier Wafer Bonding/Debonding for Thinner Wafer Processing EVG |
| 10:30–10:40 | Break |
| 10:40–12:10 |
Advanced Bonding and Molding Technologies for next generation 3D and SIP
Dr. Ruurd Boomsma, CTO of Besi Higher Resolution & Throughput AOI Wafer Inspection Solutions Camtek
New generation thick film photoresists for advanced packaging
Dr. PingHung Lu, Head of Technical Marketing & Application Engineering/ Thick Film Resists, Merck |
| 12:10–13:40 | Lunch / Registration |
| 13:40–14:40 |
Welcome by TIARA
High resolution photoresist for thicker metal bumping processing Mr. Yasushi Washio, Superior Technical Specialist, TOK
Next generation lithography solution in 3D SiP Packaging technology
ORC |
| 14:40–14:50 | Break |
|
14:50–15:50
|
PVD Developments for High Density
Mr. Mike Cheng, Application Manager Asia & Senior Service Manager, SPTS Closing Keynote Dr. Kuan-Neng Chen, IEEE Fellow, VP & Micron Chair Professor, NCTU |
